onsemi’s Treo Platform Selected by Teledyne for Advanced Infrared Imaging Design
onsemi today announced that Teledyne Technologies has selected its Treo platform to develop next-generation readout integrated circuit (ROIC) application-specific integrated circuits (ASICs) for infrared imaging systems.
Treo’s ROIC process technology leverages high-density, low-power architecture for mission-critical aerospace, defense, security, and scientific applications.
As the industry’s most advanced analog and mixed-signal platform, Treo can be combined with specialized ROIC modules to meet the demands of infrared focal plane array (FPA) systems.
Built on an advanced 65nm node, the Treo platform features a modular architecture and a rich set of IP building blocks that help speed up development and reduce time-to-market.
No direct quote available in the text.
Author's summary: onsemi's Treo platform selected for infrared imaging.
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